Hot Air Leveling (HAL) with leaded solders has been the most usual surface treatment of conductor boards for years. The affordability of the procedure and the surface features attainable meet the wide-ranged request for new applications. And compared to other finishing procedures, tinned surfaces show very good soldering properties.

The ban of lead forced the electronic industry to move to the application of unleaded solders – an enormous challenge for the entire sector since this new process needed far higher temperatures and a solder essentially more aggressive to metals.

The Bochum company PENTAGAL Chemie und Maschinenbau GmbH succeeded in adapting and improving these parameters within a research project. The new solder compounds from tin-copper-silver-nickel-alloys are equivalent to those produced with conventional plumbiferous and/or tinny solders and transferable without further ado from the board industry to the processing of unleaded solders. Next goal of the company PENTAGAL is the development of a user-friendly range of systems that considers the variety in practical applications - different capacities, board sizes and structures.


Project Operation
PENTAGAL Chemie und Maschinenbau GmbH
Carolinenglückstraße 35
44793 Bochum
Telefon 0234 523237
Fax 0234 522989
info@pentagal.de
www.pentagal.de

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